Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate
2005-10-11
2005-10-11
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
With shielding
C257S704000
Reexamination Certificate
active
06953985
ABSTRACT:
An exemplary method and apparatus for MEMS device wafer level and/or array packaging comprises inter alia an EM shielding array of dielectric lid elements (340) sealed to a MEMS device die array (300) to produce a sealed MEMS device package array (330). Disclosed features and specifications may be variously controlled, adapted or otherwise optionally modified to improve hermetic sealing and/or EM shielding for any MEMS device. An exemplary embodiment of the present invention representatively provides for wafer level packaging of RF MEMS switches prior to device singulation.
REFERENCES:
patent: 6242842 (2001-06-01), Pahl et al.
patent: 6323550 (2001-11-01), Martin et al.
patent: 6504256 (2003-01-01), Shah et al.
patent: 6624003 (2003-09-01), Rice
patent: 6667549 (2003-12-01), Cahill
patent: 2004/0067604 (2004-04-01), Ouellet et al.
Amrine Craig
De Silva Ananda P.
Fay Owen
Hughes Henry G.
Lin Jong-Kai
Freescale Semiconductor Inc.
Zarneke David A.
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