Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2008-09-04
2010-02-16
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S781000, C438S613000
Reexamination Certificate
active
07663250
ABSTRACT:
A wafer level package and a manufacturing method thereof capable of reducing stress between an under bump metal and a bump. The wafer level package includes a substrate provided with a plurality of chip pads on a top surface; a first passivation layer to expose the chip pads; vias connected to the chip pads by passing through the first passivation layer; a metal wiring layer formed on the first passivation layer and connected to the vias; an under bump metal formed on the first passivation layer to be connected to the metal wiring layer and having a buffer pattern separated through a trench on a center; a second passivation layer formed on the first passivation layer to expose the under bump metal; a first bump formed on the buffer pattern; and a second bump filling the trench and formed on the first bump and the under bump metal.
REFERENCES:
patent: 6930032 (2005-08-01), Sarihan et al.
patent: 7164208 (2007-01-01), Kainou et al.
patent: 2006/0113681 (2006-06-01), Jeong et al.
patent: 2006/0246706 (2006-11-01), Ke et al.
patent: 2007/0018321 (2007-01-01), Hiatt et al.
patent: 2007/0069394 (2007-03-01), Bachman et al.
patent: 2007/0114674 (2007-05-01), Brown
Baek Jong Hwan
Jeon Hyung Jin
Kweon Young Do
Lee Jong Yun
Yi Sung
Clark S. V
Samsung Electro-Mechanics Co. Ltd.
LandOfFree
Wafer level package and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer level package and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer level package and manufacturing method thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4203937