Wafer level LED package structure and method for making the...

Details Wafer level LED package structure and method for making the... Wafer level LED package structure and method for making the...

2011-04-12

2011-04-12

Louie, Wai-Sing (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S098000

Reexamination Certificate

active

07923747

ABSTRACT:
A wafer level LED package structure includes a light-emitting unit, a first conductive unit, a second conductive unit and an insulative unit. The light-emitting unit has a light-emitting body, a positive conductive layer and a negative conductive layer formed on the light-emitting body, and a first insulative layer formed between the positive conductive layer and the negative conductive layer. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive layer formed on the first positive conductive layer and a second negative conductive layer formed on the first negative conductive layer. The insulative unit has a second insulative layer formed on the first insulative layer and disposed between the second positive conductive layer and the second negative conductive layer.

REFERENCES:
patent: 6110823 (2000-08-01), Eldridge et al.
patent: 6185238 (2001-02-01), Onomura et al.
patent: 6655810 (2003-12-01), Hayashi et al.
patent: 6977396 (2005-12-01), Shen et al.
patent: 2003/0010986 (2003-01-01), Lin et al.

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