LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Stacked CMOS SRAM cell with polysilicon transistor load

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Stacked conductive resistive polysilicon lands in multilevel sem

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Stacked contact bump

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Stacked CVD oxide architecture multi-state memory cell for mask

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked DCA memory chips

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Stacked device conductive path connectivity

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Stacked device package for peripheral and center device pad...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Stacked device underfill and a method of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor

Stacked devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Stacked dice standoffs

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Stacked die assembly having semiconductor die overhanging...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked die assembly having semiconductor die projecting...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked die BGA or LGA component assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Stacked die design with supporting O-ring

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Stacked die integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Stacked die integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked die package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Stacked die package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Stacked die package for semiconductor devices