Stacked device conductive path connectivity

Details Stacked device conductive path connectivity Stacked device conductive path connectivity

2008-09-30

2011-11-22

Andujar, Leonardo (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S678000, C257S685000, C257S701000

Reexamination Certificate

active

08063491

ABSTRACT:
Various embodiments include apparatus and methods having circuitry to test continuity of conductive paths coupled to dice arranged in a stack.

REFERENCES:
patent: 2008/0296697 (2008-12-01), Hsu et al.

Affiliated with

Also associated with

Rating

Stacked device conductive path connectivity does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked device conductive path connectivity, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked device conductive path connectivity will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4284867