Stacked die integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Reexamination Certificate

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Details

C257S084000, C438S063000, C438S064000, C438S065000, C438S456000

Reexamination Certificate

active

06229158

ABSTRACT:

BACKGROUND
This invention relates generally to integrated circuit devices made up of more than one die.
In a number of integrated circuit applications, relatively complex functions may be involved. Thus, in some cases, the capabilities desired to be integrated into a single integrated circuit die may exceed the available processing capabilities. Some functionalities are placed on one die and other functionalities are placed on another die.
The packaged dies may then be coupled together, for example by securing them to printed circuit boards having metallic interconnections to connect signals travelling between the two dies. This has the disadvantage that the footprint or size of the combined integrated circuit device is increased because spacing is needed between the d ies to allow the desired interconnections. In addition, the resulting device may be slower due to the impedances arising from the metallic interconnections and the contacts to each die.
Thus, there is a continuing need for techniques for providing advanced functions in compact, multiple die integrated circuits.
SUMMARY
In accordance with one aspect, an integrated circuit device includes a pair of dies each having a face and a back. The dies are coupled together with their faces opposed to one another. One of the dies has a radiation emitter and the other of the dies has a radiation detector arranged to detect the radiation emitted by the emitter.


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patent: 5883395 (1999-03-01), Krause

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