Stacked DCA memory chips

Details Stacked DCA memory chips Stacked DCA memory chips

1991-08-05

1993-10-12

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257692, 257724, 439 69, 439 74, 371 81, 371 101, 371 111, 361749, 361772, H01L 2302, H01L 2312

Patent

active

052528570

ABSTRACT:
A memory system package is provided by placing memory chips face-to-face using as an interposer a thin flexible carrier having through-carrier-connections, vias, for common memory chip I/O pads which are brought out to access external signals, either control, I/O or power. These external signals may also be wired to memory chip pads that are not common.

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K. J. Roche, `Wrap Around C-Clip` IBM Tech. Disclosure Bulletin, vol. 5 No. 11, Apr. 1963, p. 14.
Patent abstract of Japan, vol. 13, No. (E-785) (3649) Jul. 1989, & JP-A-10 80 032 (Hitachi) Mar. 24, 1989, abstract.

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