Stacked die integrated circuit device

Details Stacked die integrated circuit device Stacked die integrated circuit device

1999-05-25

2000-07-25

Ngo, Ngan V.

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

In combination with or also constituting light responsive...

257 81, 257 84, H01L 3100, H01L 2715

Patent

active

060939389

ABSTRACT:
A compound die may be formed of two dies each having face and back sides, said dies being connected with said dies in face to face alignment. A radiation communication system may be used to assist in aligning the dies and in providing communications between the two dies. In this way, a composite structure may be produced which has advanced capabilities, a small footprint, and low impedance.

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patent: 5753928 (1998-05-01), Krause
patent: 5883395 (1999-03-01), Krause

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