Stacked die assembly having semiconductor die projecting...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE25013, C257SE23052, C257SE23140, C257SE23036, C257S685000, C257S777000, C257S723000, C257S786000, C257S784000, C257S724000, C257S725000, C257S728000

Reexamination Certificate

active

07459776

ABSTRACT:
A stack of semiconductor dies is disclosed. A first stack level includes a first semiconductor die and at least one first support that are attached to a substrate surface. A second level includes a second semiconductor die and at least one second support that are attached to the active surface of the first semiconductor die and to a coplanar surface of the first support(s). A third level includes a third semiconductor die attached to the active surface of the second semiconductor die and to a coplanar surface of the second support(s). The second and third semiconductor dies do not overlap bond pads of the first and second semiconductor dies, respectively. An adhesive film overlies the entire inactive surface of the second and third semiconductor dies, and attaches the second and third semiconductor dies to the immediately underlying active surface and support(s).

REFERENCES:
patent: 5291061 (1994-03-01), Ball
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5502289 (1996-03-01), Takiar et al.
patent: 5721452 (1998-02-01), Fogal et al.
patent: 5815372 (1998-09-01), Gallas
patent: 5886412 (1999-03-01), Fogal et al.
patent: 5963794 (1999-10-01), Fogal et al.
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6100594 (2000-08-01), Fukui et al.
patent: 6215193 (2001-04-01), Tao et al.
patent: 6448659 (2002-09-01), Lee
patent: 6633086 (2003-10-01), Peng et al.
patent: 6664644 (2003-12-01), Morozumi
patent: 6714418 (2004-03-01), Frankowsky et al.
patent: 6744141 (2004-06-01), Kimura
patent: 6750545 (2004-06-01), Lee et al.
patent: 6930378 (2005-08-01), St. Amand et al.
patent: 7071568 (2006-07-01), St. Amand et al.
patent: 7132753 (2006-11-01), St. Amand et al.
patent: 2002/0096785 (2002-07-01), Kimura
patent: 2003/0011067 (2003-01-01), Kimura
patent: 2003/0038374 (2003-02-01), Shim et al.
patent: 2004/0016939 (2004-01-01), Akiba et al.
patent: 2004/0037059 (2004-02-01), Stiborek et al.
patent: 2004/0053442 (2004-03-01), Akram et al.
patent: 2004/0075164 (2004-04-01), Pu et al.
patent: 2004/0126926 (2004-07-01), Arai et al.
patent: 2004/0195591 (2004-10-01), Gehman et al.
patent: 2004/0212096 (2004-10-01), Wang
patent: 2005/0156323 (2005-07-01), Tokunaga
patent: 60182731 (1985-09-01), None
patent: 63128736 (1988-06-01), None
patent: 2004-158716 (2004-06-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Stacked die assembly having semiconductor die projecting... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked die assembly having semiconductor die projecting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked die assembly having semiconductor die projecting... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4034981

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.