Stacked device package for peripheral and center device pad...

Details Stacked device package for peripheral and center device pad... Stacked device package for peripheral and center device pad...

2007-04-17

2007-04-17

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S777000

Reexamination Certificate

active

11064107

ABSTRACT:
An assembly method is disclosed that includes providing a substrate, securing a first semiconductor device on a first surface thereof, and superimposing at least a second semiconductor device at least partially over the first semiconductor device is disclosed. An outer peripheral portion of the second semiconductor device overhangs both the first semiconductor device and the substrate. Discrete conductive elements are placed between the outer peripheral portion of the second semiconductor device and a second surface of the substrate. Intermediate portions of the discrete conductive elements pass outside of a side surface of the substrate. Assemblies and packaged semiconductor devices that are formed in accordance with the method are also disclosed.

REFERENCES:
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5719440 (1998-02-01), Moden
patent: RE36613 (2000-03-01), Ball
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6212767 (2001-04-01), Tandy
patent: 6218202 (2001-04-01), Yew et al.
patent: 6337226 (2002-01-01), Symons
patent: 6388313 (2002-05-01), Lee et al.
patent: 6472736 (2002-10-01), Yeh et al.
patent: 6525412 (2003-02-01), Noshita
patent: 6569709 (2003-05-01), Derderian
patent: 6696748 (2004-02-01), Thurgood
patent: 6744137 (2004-06-01), Kinsman
patent: 6744141 (2004-06-01), Kimura
patent: 6773960 (2004-08-01), Fee et al.
patent: 6777799 (2004-08-01), Kikuma et al.
patent: 6914267 (2005-07-01), Fukasawa et al.
patent: 2002/0053727 (2002-05-01), Kimura
patent: 2003/0038354 (2003-02-01), Derderian
patent: 2004/0164413 (2004-08-01), Hall et al.

Affiliated with

Also associated with

Rating

Stacked device package for peripheral and center device pad... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked device package for peripheral and center device pad..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked device package for peripheral and center device pad... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3748838