Stacked contact bump

Details Stacked contact bump Stacked contact bump

2008-05-27

2008-05-27

Quach, Tuan N. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S780000, C257SE23021, C257SE23078

Reexamination Certificate

active

07378734

ABSTRACT:
A novel method for providing bump structures that can be formed by conventional stud bump bonding techniques is disclosed. The bumps can be arranged in a buttressed configuration that allows for substantial lateral and vertical contact loads, and substantial heights. A side-by-side configuration may be used to build a stacked bump contact that is substantially taller and stronger than is possible under current techniques. Other arrangements can be selected to optimize the load bearing capacity in any direction or combination of directions.

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patent: 2007/0057685 (2007-03-01), Garabedian et al.
patent: 2007/0090537 (2007-04-01), Shim et al.

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