Search
Selected: All

Chip package with a ring having a buffer groove that...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with asymmetric molding

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with degassing holes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With means to prevent explosion of package
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with die and substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with die and substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with die and substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with embedded component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with embedded panel-shaped component

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with grease heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with grease heat sink and method of making

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with microlens array

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with multiple chips connected by bumps

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with transfer mold underfill

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package without core and stacked chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package without core and stacked chip package structure...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package, a chip carrier, a terminal electrode for a circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package, method of making same and digital camera...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip packages with covers

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0
  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.