Chip package with multiple chips connected by bumps

Details Chip package with multiple chips connected by bumps Chip package with multiple chips connected by bumps

2007-07-10

2007-07-10

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257SE23021, C257SE23079, C257SE25013, C257SE21508, C257SE21705, C257S784000, C257S786000, C257S737000, C257S734000, C257S738000, C257S760000, C257S758000

Reexamination Certificate

active

10695630

ABSTRACT:
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.

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