Chip package with microlens array

Details Chip package with microlens array Chip package with microlens array

1993-02-26

1994-10-25

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

In combination with or also constituting light responsive...

257 84, 257 98, 257 99, 257432, 257434, 385 49, H01L 3112

Patent

active

053592085

ABSTRACT:
A chip package for an IC chip having at least an optical-signal input or output section comprises a container-like chip carrier for carrying the IC chip, a sealing cover bonded to the chip carrier and having a window for the optical-signal section, and a connector plate holding a plurality of optical signal transmission elements which are used to transmit a plurality of optical signals en bloc so that optical signals are input to or output from the optical-signal section through the window on the cover. The chip carrier and the connector plate are securely attached to a circuit board in the state where the connector plate has been separately positioned in a predetermined spatial relationship with the chip carrier.

REFERENCES:
patent: 4225213 (1980-09-01), McBride, Jr. et al.
patent: 4862231 (1989-08-01), Abend
patent: 5093879 (1992-03-01), Bregman et al.

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