Chip package, a chip carrier, a terminal electrode for a circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257774, 257777, 257760, 257693, H01L 23498, H01L 2350, H01L 2302, H01L 2312

Patent

active

056400519

ABSTRACT:
A chip carrier according to the present invention includes: a carrier body including an upper face, a lower face, and an internal conductor; and a plurality of terminal electrodes formed on the upper face of the carrier body, the plurality of terminal electrodes electrically connecting an LSI chip to the internal conductor. A plurality of concave portions for electrically connecting a plurality of electrodes on a circuit substrate to the internal conductor are provided on the lower face of the carrier body, the concave portions being electrically connected to the internal conductor.

REFERENCES:
patent: 4714570 (1987-12-01), Nakatani et al.
patent: 4825284 (1989-04-01), Soga et al.
patent: 5004640 (1991-04-01), Nakatani et al.
patent: 5118386 (1992-06-01), Kataoka et al.
patent: 5196089 (1993-03-01), Takada et al.
patent: 5213676 (1993-05-01), Rule et al.
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5260518 (1993-11-01), Tanaka et al.
patent: 5281151 (1994-01-01), Arima et al.
patent: 5315239 (1994-05-01), Vitriol
patent: 5316788 (1994-05-01), Dibble et al.
patent: 5397917 (1995-03-01), Ommen et al.
patent: 5404044 (1995-04-01), Booth et al.
patent: 5408121 (1995-04-01), Nakamura et al.
patent: 5426072 (1995-06-01), Finnila
Search Report for European Appl. 94119486.2 mailed Jan. 5, 1996.
Search Report for European Appl. 94119486.2, mailed Oct. 30, 1995.
EP&P News, 31 (1991), Jun., Nov., Mass, "Advanced Packaging Systems Completes 100 MCM Designs."
Nicolas et al, "Evolution des Technologies d'interconnexion et d'Encapsulation . . . ", pp. 48-54, Nov.-Dec. 93, vol. 73, No. 6.
Nikkei Electronics, No. 587, "LSI Package Frontier, Prompting High Density Mounting", Aug. 2, 1993, pp. 93-99 (partial translation included).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Chip package, a chip carrier, a terminal electrode for a circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip package, a chip carrier, a terminal electrode for a circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip package, a chip carrier, a terminal electrode for a circuit will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2160154

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.