Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2007-05-29
2007-05-29
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257SE25013, C257SE23055, C257SE23004, C257SE23114, C257SE23063, C257SE23172, C257SE23145, C257SE23154, C257SE23135, C257S784000, C257S734000, C257S692000, C257S738000, C257S528000, C257S686000, C257S723000, C257S728000, C257S777000, C257S778000, C257S668000, C257S532000, C257S535000
Reexamination Certificate
active
11148813
ABSTRACT:
A bump-less chip package is provided. The bump-less chip package includes a chip, an interconnection structure and a panel-shaped component. The panel-shaped component has a plurality of electrical terminals on a first surface thereof. The back surface of the chip is disposed on the first surface of the panel-shaped component, and the chip has a plurality of first pads on the active surface thereof away from the panel-shaped component. The interconnection structure is disposed on the first surface of the panel-shaped component and the active surface of the chip. The first pads of the chip may electrically connect with the electrical terminals of the panel-shaped component through the interconnection structure. Furthermore, the interconnection structure has a plurality of second pads on the surface away from the chip.
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J.C. Patents
Via Technologies Inc.
Williams Alexander Oscar
LandOfFree
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