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Package and package module of the package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Package and packaging assembly of microelectromechanical...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
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Package and packaging assembly of microelectromechanical...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
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Package and semiconductor device for preventing occurrence...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
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Package assembly for electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Package board for multiple-pin ball grid array package,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Package board having internal terminal interconnection and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Package body and semiconductor chip package using same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Package body for integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Transmission line lead
Patent

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Package carrier having multiple individual ceramic substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Package circuit board with a reduced number of pins and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Package construction for integrated circuit chip with bypass cap

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Package design and method of manufacture for chip grid array

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Package design using thermal linkage from die to printed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Package device having crack arrest feature and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
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Package device with electromagnetic interference shield

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
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Package for a high power electrical component

Active solid-state devices (e.g. – transistors – solid-state diode – Bipolar transistor structure – With enlarged emitter area
Patent

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Package for a high-frequency electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Package for a light emitting element

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...
Reexamination Certificate

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Package for a power semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
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