Package body and semiconductor chip package using same

Details Package body and semiconductor chip package using same Package body and semiconductor chip package using same

1998-02-11

2000-02-29

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257778, 257686, H01L 23053

Patent

active

06031284&

ABSTRACT:
A package for housing an electronic device without the use of wire bonds includes a package body with a first cavity formed in its top surface, and a second cavity formed in a bottom surface of the first cavity. A plurality of signal lines in the package body connect the bottom surface of the second cavity to the bottom surface of the package body. A semiconductor chip package incorporating the package of the present invention further includes a semiconductor chip mounted in the package body. Bonding pads on the semiconductor chip are connected to the signal lines on the bottom surface of the second cavity via electrically conductive bumps.

REFERENCES:
patent: 5043794 (1991-08-01), Tai et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5838061 (1998-11-01), Kim

Affiliated with

Also associated with

Rating

Package body and semiconductor chip package using same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package body and semiconductor chip package using same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package body and semiconductor chip package using same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-685665