Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate
2011-01-11
2011-01-11
Zarneke, David A (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
C257SE27122
Reexamination Certificate
active
07868402
ABSTRACT:
A package of microelectromechanical system (MEMS) microphone is suitable for being mounted on a printed circuit board. The package has a cover and at least one MEMS microphone. The cover has an inner surface and a conductive trace disposed thereon. The MEMS microphone is mounted on the inner surface of the cover and electrically connected to the conductive trace, and has an acoustic pressure receiving surface. When the cover is mounted on the printed circuit board, the cover and the printed circuit board construct an acoustic housing which has at least one acoustic hole passing through the cover or the printed circuit board, and the conductive trace on the inner surface of the cover is electrically connected to the printed circuit board.
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“Office Action of Taiwan counterpart application”, issued on Oct. 7, 2009, p. 1-p. 6.
Chien Hsin-Tang
Huang Chao-Ta
Industrial Technology Research Institute
Jianq Chyun IP Office
Wagner Jenny L
Zarneke David A
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