Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-01-05
2010-02-16
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23114, C257SE23025, C257SE25013, C257SE23079, C257SE23069, C257SE23061, C257S698000, C257S696000, C257S778000, C257S738000, C257S784000, C257S783000, C257S782000, C257S737000, C257S691000
Reexamination Certificate
active
07663221
ABSTRACT:
A package circuit board having a reduced package size. The package circuit board may include a semiconductor substrate in place of a printed circuit board. The package circuit board may further include a microelectronic chip mounted on the semiconductor substrate, the microelectronic chip having at least one of active and passive elements formed on the semiconductor substrate semiconductor substrate.
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German Office Action dated Sep. 26, 2008.
Jang Kyung-Lae
Lee Hee-Seok
Harness Dickey & Pierce
Samsung Electronics Co,. Ltd.
Williams Alexander O
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