Package assembly for electronic device

Details Package assembly for electronic device Package assembly for electronic device

2007-07-03

2007-07-03

Williams, Alexander Oscr (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257SE23125, C257SE21511, C257S780000, C257S698000, C257S783000, C257S782000, C257S668000, C257S737000, C257S738000, C257S772000, C257S779000, C257S734000, C257S691000

Reexamination Certificate

active

10671334

ABSTRACT:
A buffer layer is formed on a substrate and then electronic devices are packed on the buffer layer in the present invention, and problems of lower hermeticity and complex process in the conventional arts can be avoided. Therefore, the present invention provides a packaging structure and method with a better hermeticity and a simpler process. Especially, due to the buffer layer, the planarization for flip-chip bonding can be improved and reduce negative effects of the packing process.

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