Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate
2011-04-12
2011-04-12
Sefer, A. (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
C257S416000, C257S252000, C257S254000, C257S686000, C257SE23180, C257SE29324
Reexamination Certificate
active
07923791
ABSTRACT:
A package of a MEMS microphone is suitable for being mounted on a printed circuit board. The package includes a substrate, at least one MEMS microphone, and a conductive sealing element. The MEMS microphone is arranged on the substrate, and electrically connected to a conductive layer on a bottom surface of the substrate. The conductive sealing element is arranged on the substrate and around the MEMS microphone for connecting the printed circuit board, and constructs an acoustic housing with the printed circuit board and the substrate. The acoustic housing has at least one acoustic hole passing through the substrate. The acoustic hole has a metal layer on the inner wall thereof for connecting the conductive layer on the bottom surface of the substrate to another conductive layer on the top surface of the substrate.
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“Office Action of Taiwan counterpart application”, issued on Oct. 7, 2009, p. 1-p. 6.
Chien Hsin-Tang
Huang Chao-Ta
Industrial Technology Research Institute
Jianq Chyun IP Office
Sefer A.
Woldegeorgis Ermias
LandOfFree
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