Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate
2006-01-23
2008-08-12
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
With shielding
C257S666000
Reexamination Certificate
active
07411278
ABSTRACT:
The present invention provides a package device for reducing the electromagnetic/radio frequency interference, which includes a first substrate with a shielding structure on the under surface of the first substrate, and an insulating layer on the shielding structure. The first substrate includes a through hole that is filled with the conductor therein. A plurality of lead-frames located on the bottom surface of the first substrate. A second substrate located above between the two lead-frames. Then, the molding compound encapsulated to cover the above structures to form a package device. Therefore, the shielding path of the package device is constructed of the plurality of lead-frames, the conductor within the first substrate, the shielding structure, and the grounded to discharge the electromagnetic/radio frequency out of the package device, thus, the electromagnetic/radio frequency interference for the package device can be reduced.
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Chen Da-Jung
Day Chih-Chan
Lin Chun-Liang
Wen Chau Chun
Birch & Stewart Kolasch & Birch, LLP
Clark S. V
Cyntec Co., Ltd.
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