Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1998-03-03
1999-08-17
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257700, 257723, 257778, H01L 2304
Patent
active
059397829
ABSTRACT:
An integrated circuit assembly includes an integrated circuit die having a first face, a second face and a perimeter. The second face bears a plurality of electrical contacts. A substrate is coupled to the die and has a first surface and a second surface facing in a different direction from the first surface. The substrate has a plurality of layers between the first and the second surfaces, at least some of the layers having one or more electrical traces. A compartment extends from the second surface through a plurality of the layers and has surfaces defining an inner chamber including a device interface surface. A plurality of electrically conductive vias extend through a plurality of the layers and at least two non-intersecting vias extend from the first surface and are coupled to electrical contacts of the substrate and to the device interface surface. An auxiliary circuit device is located within the inner chamber and the auxiliary circuit device is electrically coupled to the non-intersecting vias and hence coupled to the die.
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Clark Sheila V.
Sun Microsystems Inc.
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