Package carrier having multiple individual ceramic substrates

Details Package carrier having multiple individual ceramic substrates Package carrier having multiple individual ceramic substrates

2005-06-07

2005-06-07

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S685000, C257S723000

Reexamination Certificate

active

06903456

ABSTRACT:
A package carrier has multiple ceramic substrates and a frame with a polymid tape. The frame has multiple through holes for receiving the ceramic substrates. The ceramic substrates are packaged with chips. The frame is made of plastic so the package carrier can be easily cut to separate individual electronic devices. The present invention combines individual ceramic substrates with the plastic frame so the cutting time can be reduced and the quantity of electronic devices fabricated is increased.

REFERENCES:
patent: 4810616 (1989-03-01), Grabbe et al.
patent: 6818473 (2004-11-01), Kim et al.
patent: 2003/0218236 (2003-11-01), Wright et al.

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