Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-04-26
2009-06-16
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S685000, C257S686000, C257S693000, C257S773000, C257S776000, C257SE25013, C257SE25031, C257SE23067, C257SE23069
Reexamination Certificate
active
07547965
ABSTRACT:
A package includes a carrier, a first chip, a first dielectric layer and at least one first connecting part. The carrier has a first surface and a second surface, and at least one first pad is disposed on the second surface. The first chip is disposed on the first surface. The first dielectric layer is disposed on the first surface and covers the first chip. The first connecting part is disposed in the first dielectric layer and disposed around an edge of the first chip to electrically connect the first chip with the first pad. A package module of the package is also disclosed.
REFERENCES:
patent: 6506632 (2003-01-01), Cheng et al.
patent: 7084513 (2006-08-01), Matsuki et al.
patent: 2003/0134455 (2003-07-01), Cheng et al.
patent: 2004/0178495 (2004-09-01), Yean et al.
patent: 2005/0218518 (2005-10-01), Jiang et al.
Birch & Stewart Kolasch & Birch, LLP
Clark Jasmine J
VIA Technologies Inc.
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