Package and package module of the package

Details Package and package module of the package Package and package module of the package

2006-04-26

2009-06-16

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S685000, C257S686000, C257S693000, C257S773000, C257S776000, C257SE25013, C257SE25031, C257SE23067, C257SE23069

Reexamination Certificate

active

07547965

ABSTRACT:
A package includes a carrier, a first chip, a first dielectric layer and at least one first connecting part. The carrier has a first surface and a second surface, and at least one first pad is disposed on the second surface. The first chip is disposed on the first surface. The first dielectric layer is disposed on the first surface and covers the first chip. The first connecting part is disposed in the first dielectric layer and disposed around an edge of the first chip to electrically connect the first chip with the first pad. A package module of the package is also disclosed.

REFERENCES:
patent: 6506632 (2003-01-01), Cheng et al.
patent: 7084513 (2006-08-01), Matsuki et al.
patent: 2003/0134455 (2003-07-01), Cheng et al.
patent: 2004/0178495 (2004-09-01), Yean et al.
patent: 2005/0218518 (2005-10-01), Jiang et al.

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