Package board having internal terminal interconnection and...

Details Package board having internal terminal interconnection and... Package board having internal terminal interconnection and...

2006-06-16

2010-06-29

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S678000, C257S698000

Reexamination Certificate

active

07745922

ABSTRACT:
A package board is provided. The package board includes a board body having a front surface and a back surface. A first power pad, a first ground pad, a first signal pad, a first internal terminal pad and a second internal terminal pad are disposed on the front surface of the board body, and a second power pad, a second ground pad and a second signal pad are disposed on the back surface of the board body. The second power pad, the second ground pad and the second signal pad are electrically connected to the first power pad, the first ground pad and the first signal pad, respectively. An internal terminal interconnection is provided in a bulk region of the board body or on a surface of the board body. The internal terminal interconnection electrically connects the first internal terminal pad to the second internal terminal pad. A semiconductor package employing the package board is also provided.

REFERENCES:
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patent: 6211576 (2001-04-01), Shimizu et al.
patent: 6400576 (2002-06-01), Davidson
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English language abstract of Korean Publication No. 10-2003-0002421.

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