Package body for integrated circuit

Details Package body for integrated circuit Package body for integrated circuit

1993-09-27

1994-12-13

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Transmission line lead

257691, 257678, 257692, 333247, 333246, H01L 2348, H01L 2944, H01L 2952, H01L 2560

Patent

active

053731875

ABSTRACT:
A package body for an integrated circuit is provided with a substrate having a mounting portion for mounting the integrated circuit. A terminal member for high speed signal input-output is provided on a portion of the substrate except the mounting portion of the substrate. A high speed signal transmission line has one end portion to be connected to the integrated circuit and the other end portion connected to the terminal member and is formed at a portion of the substrate except the mounting portion of the substrate. A plating tie-bar is formed at the substrate so as to extend from an outer periphery edge of the substrate inwardly for electrolytically plating the one end portion of the high speed signal transmission line and the terminal member. A portion of the high speed signal transmission line is arranged more extendingly toward the outer periphery edge of the substrate than the one and other end portions of the high speed signal transmission line, and the inwardly extending end portion of the plating tie-bar is connected to the extending portion of the high speed signal transmission line.

REFERENCES:
patent: 4362899 (1982-12-01), Porrill
patent: 4890155 (1989-12-01), Miyagana et al.
patent: 5194833 (1993-03-01), Dougherty et al.
Catalogue published by NGK Spark Plug Co., Ltd., "Nik Technical Ceramics For High Density IC Packages & Multilayer Substances," Sep. 1990.
Choksi et al., "Computer Aided Electrical Modeling of VLSI Packages," IEEE Journal, 1990, pp. 169-172.

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