Package for a power semiconductor device

Details Package for a power semiconductor device Package for a power semiconductor device

2011-01-25

2011-01-25

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

C257S666000, C257S675000, C438S106000, C438S121000, C438S122000

Reexamination Certificate

active

07875962

ABSTRACT:
A package for a semiconductor die includes a die attach pad that provides an attachment surface area for the semiconductor die, and tie bars connected to the die attach pad. The die attach pad is disposed in a first general plane and the tie bars are disposed in a second general plane offset with respect to the first general plane. A molding compound encapsulates the semiconductor die in a form having first, second, third and fourth lateral sides, a top and a bottom. The tie bars are exposed substantially coincident with at least one of the lateral sides. The form includes a discontinuity that extends along the at least one of the lateral sides, the discontinuity increasing a creepage distance measured from the tie bars to the bottom of the package.

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