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Packaging system for die-up connection of a die-down...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Packaging system for field effects transistors

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Patent

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Packaging system for power supplies

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Packaging system for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Packaging systems and methods

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Packaging technology for Schottky die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Patent

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Packaging with base layers comprising alloy 42

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials
Reexamination Certificate

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Packed semiconductor device with wrap around external leads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Patent

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Packed system of semiconductor chips having a semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Packing board for electronic device, packing board...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Packing density for flash memories

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Patent

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Packing structure of semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Pad and via placement design for land side capacitors

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – With contact or metallization configuration to reduce...
Reexamination Certificate

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Pad arrangement for a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Patent

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PAD arrangement in semiconductor memory device and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Pad arrangement of driver IC chip for LCD and related...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Pad array semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent

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Pad array semiconductor device having a heat sink with die recei

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Pad current splitting

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular chip input/output means
Reexamination Certificate

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Pad design

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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