Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2011-03-29
2011-03-29
Purvis, Sue (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257SE23011
Reexamination Certificate
active
07915737
ABSTRACT:
A manufacturing technology is provided capable of improving the reliability of a semiconductor module having a via contact connected to an electrode part of a semiconductor component. The semiconductor module includes: a semiconductor component provided with an electrode part on a mounting surface; an insulating layer provided on the mounting surface of the semiconductor component; a wiring layer formed on the insulating layer; a first conductor part which is embedded in the insulating layer and which is in contact with the electrode part; and a second conductor part which is formed in an aperture provided in the insulating layer above the first conductor part and which electrically connects the first conductor part and the wiring layer.
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patent: 2003/0137056 (2003-07-01), Taniguchi et al.
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Nakasato Mayumi
Okayama Yoshio
Usui Ryosuke
Fish & Richardson P.C.
Purvis Sue
Sandvik Benjamin P
Sanyo Electric Co,. Ltd.
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