Packaging system for power supplies

Details Packaging system for power supplies Packaging system for power supplies

2005-09-13

2005-09-13

Clark, S. V. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S736000

Reexamination Certificate

active

06943455

ABSTRACT:
A packaging system for a high current, low voltage power supply. The power supply uses two bare die field effect transistors whose input and output electrodes are solder attached to low resistance, high current posts in the package. An associated controller chip is mounted to a rigid circuit board, and the circuit board is mechanically attached to the posts. The circuit board thereby gives physical rigidity to the package, but carries no high currents. The use of low resistance, high current posts reduces the heat generated, improving the long term reliability.

REFERENCES:
patent: 5218231 (1993-06-01), Kudo
patent: 6521982 (2003-02-01), Crowley et al.
patent: 6528880 (2003-03-01), Planey
patent: 6707138 (2004-03-01), Crowley et al.
patent: 6747341 (2004-06-01), Knapp et al.
patent: 6768188 (2004-07-01), Moriguchi

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