Packed semiconductor device with wrap around external leads

Details Packed semiconductor device with wrap around external leads Packed semiconductor device with wrap around external leads

1996-10-24

1998-11-10

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

257666, 257685, 257686, 257696, 438124, 438126, H01L 2306, H01L 2302, H01L 2348

Patent

active

058359885

ABSTRACT:
A semiconductor device with reduced thickness, improved heat radiation, and a stacked structure. Molded resin covers an IC chip wire and part of a die pad. The die pad is exposed from the molded resin. An external lead in the same plane as the exposed surface of the die pad extends to a side of the resin opposite the die pad and along the molded resin. This structure allows a reduction in thickness of the semiconductor device, the exposed die pad improves heat radiation, and the external lead on upper and lower surfaces of the resin allows the semiconductor devices to be stacked.

REFERENCES:
patent: 4985749 (1991-01-01), Berneur et al.
patent: 5554886 (1996-09-01), Song
patent: 5581118 (1996-12-01), Mays
patent: 5600179 (1997-02-01), Suzuki
patent: 5602420 (1997-02-01), Ogata et al.
patent: 5656856 (1997-08-01), Kweon

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