Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-11-07
2008-12-02
Chu, Chris C. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE21503, C257S203000, C257S668000, C257S696000, C349S149000, C349S152000, C438S108000
Reexamination Certificate
active
07459779
ABSTRACT:
Output pads on an integrated circuit (IC) chip are arranged along a first longer side and are arranged along a second longer side with input pads. The output pads are connected to respective output patterns formed on top and bottom surfaces of a base film. All the output patterns may pass over the first longer side. Alternatively, the output patterns connected to the output pads at the second longer side may pass over a shorter side. These pattern structures establish an effective pad arrangement without increasing the size of a TAB package, yet allowing reduced the chip size.
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Chung Ye-Chung
Lee Si-Hoon
Chu Chris C.
Marger & Johnson & McCollom, P.C.
Samsung Electric Co., Ltd.
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