Packaging technology for Schottky die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

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257689, 257703, 257730, H01L 23492

Patent

active

059230835

ABSTRACT:
A hermetic packaging technology for silicon Schottky die or any other two terminal solderable die. The technology uses a pressed ceramic frame, solid metal pads, a solid metal disc, metal seal rings, and a direct high temperature solder bond to the die. There are no intermediate straps or wires used to connect the die to the metal pads. The die is actually part of the final package, or it can be said that the package is built around the die. The device is hermetically sealed for use in high reliability applications such as military or space programs. All materials used in the technology are matched for coefficient of thermal expansion (CTE).

REFERENCES:
patent: 3280389 (1966-10-01), Martin
patent: 3721867 (1973-03-01), Schierz
patent: 5081067 (1992-01-01), Shimizu et al.

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