Pad array semiconductor device having a heat sink with die recei

Details Pad array semiconductor device having a heat sink with die recei Pad array semiconductor device having a heat sink with die recei

1995-09-29

1996-12-10

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257706, 257713, 257722, 361707, 361712, 361714, H01L 2310, H01L 2334, H05K 720

Patent

active

055833772

ABSTRACT:
A semiconductor device (10) provides heat dissipation while maintaining a low profile. The device includes a circuitized substrate (12) having an opening (20). Inserted into, or at least covering, the opening is a heat sink (22) having a base portion (24), sidewalls (26), and flanges (28). Flanges of the heat sink are attached or supported by a surface of the substrate. Together the base portion and sidewalls of the heat sink form a cavity for receiving a semiconductor die (13). The die is electrically coupled to conductive traces (14) formed on the substrate by wire bonds (19), and the traces are electrically coupled to solder balls (21) by conductive vias (18). In one embodiment, base portion (24) of heat sink (22) extends below substrate (12) to permit contact to a user substrate (34). While in another embodiment, a base portion (118) of a heat sink (116) is exposed on a top surface of a substrate (112) for coupling to another heat sink (124).

REFERENCES:
patent: 3399332 (1968-08-01), Savolainen
patent: 4737395 (1988-04-01), Mabuchi et al.
patent: 4829403 (1989-05-01), Harding
patent: 4835598 (1989-05-01), Higuchi et al.
patent: 4890152 (1989-12-01), Hirata et al.
patent: 5045921 (1991-09-01), Lin et al.
patent: 5233225 (1993-08-01), Ishida et al.

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