LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

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Package stiffener

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package stress management

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package Structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure and electronic device using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure and lead frame using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure and method for chip with two arrays of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure and package substrate thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure compatible with cooling system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure for a photosensitive chip

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure for a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure for accommodating thicker semiconductor unit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure for high-power surface-mounted electronic devi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Patent

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Package structure for light emitting diode and method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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