Package structure and fabrication method thereof

Details Package structure and fabrication method thereof Package structure and fabrication method thereof

2005-01-07

2009-12-29

Lewis, Monica (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S794000, C257SE23116, C257SE23127

Reexamination Certificate

active

07638887

ABSTRACT:
A package structure and fabrication method thereof. The structure includes a substrate having a terminal, a chip overlying the substrate, the chip having an active surface, having a center region and periphery region, the periphery region having an electrode thereon, a patterned cover plate overlying the chip and exposing the electrode, a conductive material electrically connecting the electrode and terminal, and an encapsulant covering the terminal, conductive material, and electrode, but exposing the cover plate overlying the center region of the chip.

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