Package structure and electronic device using the same

Details Package structure and electronic device using the same Package structure and electronic device using the same

2008-03-27

2010-10-12

Ho, Tu-Tu V (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S713000, C257S719000, C257SE23104, C257SE23182, C257SE23192

Reexamination Certificate

active

07812433

ABSTRACT:
A package structure and an electronic device using the same are provided. The package structure includes a chip module and a cover. The chip module covered by the cover is used for receiving a first signal. The chip module includes a substrate, a heat sink and a first chip. The substrate has a first surface, a second surface and an opening. The first surface is opposite to the second surface. The opening penetrates the first surface and the second surface. The heat sink is disposed on the first surface of the substrate and covers the opening. The first chip is disposed on the heat sink and is positioned inside the opening. A bottom surface of the first chip flatly contacts the heat sink. The cover has a window element. The first signal passes through the window element to contact with the chip module.

REFERENCES:
patent: 5646828 (1997-07-01), Degani et al.
patent: 5856911 (1999-01-01), Riley
patent: 6564454 (2003-05-01), Glenn et al.
patent: 2003/0231842 (2003-12-01), Kropp
patent: 2004/0241417 (2004-12-01), Fischer et al.
patent: 2006/0022290 (2006-02-01), Chen et al.
patent: 2007/0210246 (2007-09-01), Ellenberger et al.
patent: 2008/0048120 (2008-02-01), Gooch

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