Package stiffener

Details Package stiffener Package stiffener

2007-02-06

2007-02-06

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S691000, C257S693000, C257S712000, C257S730000

Reexamination Certificate

active

09964586

ABSTRACT:
Arrangements are used to supply power to a semiconductor package.

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“Method of Heat Sinking an Array of Discrete Electronic Packages”,Kenneth Mason Publications, Hampshire, GB, No. 342, Research disclosure, XP 000326724, (Oct. 1, 1992), p. 803.

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