Package structure compatible with cooling system

Details Package structure compatible with cooling system Package structure compatible with cooling system

2006-07-04

2006-07-04

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S796000, C257SE23098

Reexamination Certificate

active

07071553

ABSTRACT:
The present invention relates to a package structure compatible with a cooling system, the package structure comprising a carrier, a chip, a mold compound and a cooling tubule that can be connected to a cooling system. The chip is arranged on the carrier and electrically connected to the carrier, while the mold compound covers the chip and one surface of the carrier. The cooling tubule is disposed either within the mold compound or on an outer surface of the mold compound. The cooling tubule is connected to a cooling tubing of the cooling system and a fluid driven by a pump circulates in the cooling tubing and the cooling tubule for heat dissipation.

REFERENCES:
patent: 5233225 (1993-08-01), Ishida et al.
patent: 5514906 (1996-05-01), Love et al.
patent: 5696405 (1997-12-01), Weld

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