Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2002-04-01
2003-07-08
Clark, Jasmine J B (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C257S704000, C257S783000
Reexamination Certificate
active
06590269
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a package structure for a photosensitive chip, and more specifically to a package structure for a photosensitive chip, which can be easily manufactured and possess high production yields.
2. Description of the Related Art
Referring to
FIGS. 1 and 2
, a conventional package structure for a photosensitive chip is manufactured according to the following steps. First, a substrate
10
, on which traces
12
are formed to define a plurality of zones
17
, is provided. Then, a plurality of photosensitive chips
13
are arranged on the plurality of zones
17
. Next, a frame layer
14
formed with a plurality of slots
16
corresponding to the traces
12
is adhered onto the substrate
10
via an adhesive layer
15
. At this time, the photosensitive chips
13
on the substrate
10
are exposed via the slots
16
. Then, a plurality of wires
18
are provided to electrically connect the photosensitive chips
13
to the substrate
10
. Next, the substrate
10
is cut into package bodies each includes the frame layer
14
, as shown in FIG.
2
. Then, as shown in
FIG. 3
, a single package body is placed within a jig
22
, and a zone for receiving a transparent glass
20
is defined. Next, the transparent glass
20
covers the frame layer
14
to finish the package processes of the photosensitive chip
13
.
There are some drawbacks in the conventional package structure for a photosensitive chip. Thus, the manufacturing processes are complicated, the yield of products is low, and the package cost is high. The drawbacks are described as follows.
1. Since the frame layer
14
has to be glued onto the substrate
10
by the glue layer and then cut into a plurality of package bodies, the gluing process has to be added and the frame layer
14
has to be treated as wasted material. Thus, the package cost is increased.
2. Since the surface of frame layer
14
to which the transparent glass
20
is glued is a flat surface, the transparent glass
20
cannot be positioned on the frame layer
14
. Accordingly, the jig
22
has to be provided when the transparent glass is to be glued onto the frame layer
14
so as to define the zone for receiving the transparent glass
20
. Thus, the package cost is also increased.
3. When the glue layer
24
is applied onto the frame layer
14
to glue the transparent glass
20
, the amount of the applied glue layer
24
is not uniform. Thus, the glued transparent glass
20
may be uneven, and the yield of the products may be influenced.
4. The covering process of the transparent glass
20
is performed after both of the substrate
10
and the frame layer
14
are cut into package bodies. At this time, the wasted material (chip) may contaminate the photosensitive chips
13
. Therefore, the yield of the photosensitive chips
13
may be influenced.
In view of these drawbacks, it is therefore an object of the invention to provide a package structure for a photosensitive chip capable of solving the drawbacks of the package structure for a photosensitive chip and making it more applicable.
SUMMARY OF THE INVENTION
It is therefore an object of the invention to provide a package structure for a photosensitive chip, which is capable of simplifying the package processes, saving the material and thus lowering the manufacturing cost.
Another object of the invention is to provide a package structure for a photosensitive chip capable of facilitating the covering process of the transparent glass so as to improve the production yield.
Still another object of the invention is to provide a package structure for a photosensitive chip capable of smoothly attaching the transparent glass onto the frame layer and improving the production yield.
To achieve the above-mentioned objects, the invention provides a package structure for a photosensitive chip. The package structure includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is formed on the substrate by way of injection molding with the first surface contacting the upper surface. A cavity is formed between the substrate and the frame layer. The second surface is formed with a depression in which plural projections each having a suitable height are formed. The frame layer is formed directly on the substrate by way of injection molding. The package structure further includes a photosensitive chip arranged within the cavity, a plurality of wires for connecting the substrate to the photosensitive chip, and a transparent layer rested on the projections within the depression. Accordingly, the yield can be improved and the manufacturing processes can be facilitated.
REFERENCES:
patent: 4972089 (1990-11-01), Stevenson
patent: H1153 (1993-03-01), August et al.
patent: 5256901 (1993-10-01), Ohashi et al.
patent: 5293069 (1994-03-01), Kato et al.
patent: 5324888 (1994-06-01), Tyler et al.
patent: 6057597 (2000-05-01), Farnworth et al.
patent: 2002/0060287 (2002-05-01), Ho et al.
Chen Allis
Chiu Yung Sheng
Chuang Jason
Ho Mon Nan
Hsieh Jachson
Clark Jasmine J B
Kingpak Technology Inc.
Pro-Techtor-Inter-National Services
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