Package structure for light emitting diode and method thereof

Details Package structure for light emitting diode and method thereof Package structure for light emitting diode and method thereof

2006-04-18

2006-04-18

Tran, Minh-Loan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With reflector, opaque mask, or optical element integral...

C257S099000, C257S100000

Reexamination Certificate

active

07030423

ABSTRACT:
A package structure for a light emitting diode (LED) includes a substrate structure and a reflective layer. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The substrate structure has an opening to expose the conduction board. The reflective layer configured to support and electrically couple to a first electrode of the LED is disposed in the opening. The reflective layer is electrically coupled to the conduction board and electrically insulated from at least a portion of the conductivity layer, which is coupled to a second electrode of the LED.

REFERENCES:
patent: 6034712 (2000-03-01), Iwasaki
patent: 6204523 (2001-03-01), Carey et al.
patent: 6345903 (2002-02-01), Koike et al.
patent: 6428189 (2002-08-01), Hochstein
patent: 6809261 (2004-10-01), Ng et al.
patent: 2001/0030866 (2001-10-01), Hochstein

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