Package structure

Details Package structure Package structure

2008-09-30

2008-09-30

Green, Telly D (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S686000, C257S666000, C257S680000

Reexamination Certificate

active

11627237

ABSTRACT:
A package structure is provided herein. The package structure includes a first substrate and a second substrate. A first seal ring having a first height is disposed around a predetermined area of the first substrate and between the first and second substrates. A second seal ring having a second height is disposed on the first substrate and around the first seal ring. A sealant is provided between the first and second seal rings to seal up the package structure.

REFERENCES:
patent: 3815771 (1974-06-01), Marks
patent: 6566745 (2003-05-01), Beyne et al.
patent: 6958285 (2005-10-01), Siniaguine
patent: 7087464 (2006-08-01), Yu
patent: 2004/0067604 (2004-04-01), Ouellet et al.

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