Package structure and lead frame using the same

Details Package structure and lead frame using the same Package structure and lead frame using the same

2006-11-08

2009-02-17

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C438S123000

Reexamination Certificate

active

07492037

ABSTRACT:
A package structure and a lead frame using the same are provided. The package structure includes a lead frame, a chip and an adhesive. The lead frame has a first surface and a second surface opposite to the first surface. The first surface has a chip adherent area. The lead frame includes a plurality of through holes and grooves. The through holes penetrate through the first surface and the second surface to be disposed around the chip adherent area. The grooves are disposed on the first surface. The grooves connect the neighboring through holes to form an annular trace disposed around the chip adherent area. The chip is disposed on the chip adherent area. The adhesive is disposed between the chip and the lead frame, and is diffused in the annular trace.

REFERENCES:
patent: 5397915 (1995-03-01), Nose
patent: 6197615 (2001-03-01), Song et al.
patent: 6303985 (2001-10-01), Larson et al.

Affiliated with

Also associated with

Rating

Package structure and lead frame using the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package structure and lead frame using the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package structure and lead frame using the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4077945