Package structure and manufacturing method thereof

Details Package structure and manufacturing method thereof Package structure and manufacturing method thereof

2008-04-02

2010-10-19

Tran, Thien F (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S706000, C257S707000, C257S778000, C257S779000, C257SE23031

Reexamination Certificate

active

07816773

ABSTRACT:
A package structure and a manufacturing method thereof are provided. The package structure includes a leadframe, a die, a solder layer and several connecting components. The leadframe includes a heat dissipation pad and several leads. The heat dissipation pad is disposed in a substantial center of the leadframe. The leads are surrounding the heat dissipation pad. The die having an active surface is disposed on the leadframe. The solder layer is disposed between the active surface and the heat dissipation pad. The connecting components are disposed between the active surface and the leads. The die is electrically connected to the leadframe through the solder layer and the connecting components.

REFERENCES:
patent: 6523608 (2003-02-01), Solbrekken et al.
patent: 6661087 (2003-12-01), Wu
patent: 6825568 (2004-11-01), Hung
patent: 6876087 (2005-04-01), Ho et al.
patent: 2005/0195681 (2005-09-01), Gembala
patent: 2008/0224283 (2008-09-01), Pu et al.

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