Package Structure

Details Package Structure Package Structure

2006-10-03

2006-10-03

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S692000, C257S782000, C257SE23031, C257SE23037, C257SE23039

Reexamination Certificate

active

07115978

ABSTRACT:
A package structure includes a lead frame having a plurality of leads, each of which includes a first recession, at least a first device, and a plurality of solder joints respectively positioned in the first recessions for connecting the first device to the lead frame.

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patent: 3436818 (1969-04-01), Merrin et al.
patent: 5682057 (1997-10-01), Kuriyama
patent: 6127206 (2000-10-01), Nakamichi
patent: 6507120 (2003-01-01), Lo et al.
patent: 6608375 (2003-08-01), Terui et al.
patent: 6984878 (2006-01-01), Park et al.
patent: 7005325 (2006-02-01), Chow et al.
patent: 456015 (2001-09-01), None
patent: 567598 (2003-12-01), None

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