Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2007-05-29
2007-05-29
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S783000, C257S787000, C257SE23116
Reexamination Certificate
active
10918416
ABSTRACT:
A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.
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patent: 2002/0093107 (2002-07-01), Wu et al.
patent: 2005/0029666 (2005-02-01), Kurihara et al.
Chen Shih-Li
Chou Chao-Nan
Lin Chih-Wei
Lin Ming-Hui
Sun Wen-Bin
Advanced Chip Engineering Technology Inc.
Birch & Stewart Kolasch & Birch, LLP
Parekh Nitin
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