LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Semiconductor package with improved moisture vapor relief functi

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor package with increased number of input and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor package with increased number of input and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor package with inner leads exposed from an...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor package with metal pads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Semiconductor package with molded plastic body

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor package with no void in encapsulant and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...

Semiconductor package with passive device integration

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor package with recessed leadframe and a recessed...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor package with segmented lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor package with singulation crease

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor package with stacked dice for a buck converter

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Semiconductor package with warpage resistant substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor package without substrate and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor package, method for manufacturing the same and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor package-on-package system including integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Semiconductor packages for high I/O semiconductor dies

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor packages having split die pad

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor packages with centrally located electrode pads