Semiconductor packages for high I/O semiconductor dies

Details Semiconductor packages for high I/O semiconductor dies Semiconductor packages for high I/O semiconductor dies

1996-06-14

1998-06-16

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257724, 257780, 257784, 257786, H01L 23495, H01L 2334

Patent

active

057675708

ABSTRACT:
Techniques for providing semiconductor packages capable of forming connections to "high I/O" semiconductor dies is described, wherein there are at least two distinct pluralities of conductive lines. Leadframe-type packages and substrate-based package embodiments are described.

REFERENCES:
patent: 5340771 (1994-08-01), Rostoker
patent: 5534467 (1996-07-01), Rostoker

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